Copper Electrode manufacturing process

Copper Electrode (Copper EDM Electrode) — Technical Reference (Consolidated & Revised Edition)

 

1.Overview & Definition

A "copper electrode" (also referred to as an EDM electrode or "copper pole" in industry practice) is the discharge medium used in electrical discharge machining (EDM) for mold manufacturing. It is primarily applied to the precision forming of cavity surfaces and other intricate mold features.

2.Core Function:

Acts as a "shaping tool" that transfers the designed geometry onto the mold steel through electrical erosion.

Naming Origin: It is commonly called "copper electrode" because it is predominantly made of pure copper (red copper) due to its excellent conductivity and machinability.

3.Basic Workflow: Product drawing → Mold design drawing → Electrode splitting → CNC machining of electrode → EDM machining of the mold → Finished product.

                                                        Copper Electrode manufacturing process

Welcome to contact us if any interest about the Copper Electrode www.jacarlosworld.com

"Pin Fin heat sink" VS "Skived Fins heat sink"

Engineers always interested in the differnece with Pin Fin heat sink and Skived Fins heat sink, hereby we made  a comparision against the 2 heat sinks as following, hope it can help you to make decisions for the perfect solutions. 

1.The Pin Fin heat sink for IGBT made by “ Forging”, which makes it possible to achieve significantly cooling performance against other manufacturing process, with some obvious advantages as following.

*Complete in one piece by cold forging with no interface

*Material: Al1050/1070 or Al6063, C1100, Cu/Al bonded Material

*High material density increases thermal conductivity

*Round pins improves airflow smooth through (Round, Ellipse, Square fins are available)

*High aspect ratio 1:50

*Better cooling performance

*Wide range of geometry

*Weight reduction

*High quality and very competitive price

 2.The Skiving has some features and benefits as following.

(1).Material: Al1050/1070 or C1100

(2).Maximum heat dissipation under forced convection (with high airflow)

(3).No interface joint (or thermal resistance) between the fins and base

(4).High aspect ratio (up to 50)

(5).Easy and inexpensive to prototype

(6).Short lead time

(7).Can have embedded heat pipes to further boost performance

(8).Anti-oxidation surface treatment helps extend serving time

Jacarlos Industries Co., Ltd founded in 1996, we have 30 years successful experience in thermal management solutions . We have experienced significant growth in the past years and continues to move upward to address the needs of the global market through improved technology. 

We achieve to provide one-stop thermal managment solutions help our custmers succeed. From design, thermal simulation to manufacturing, customized projects are welcome. 

 To know more about us 

www.jacarlosworld.com

https://www.youtube.com/@jacarlosworld

https://www.youtube.com/@ThermalManagement

The Liquid Cooling Cold Plates made by Furnace Brazing

Furnace brazing uses a furnace to heat parts and brazing metal to brazing temperature, fusing the joints for medium to high production rates. Furnace brazing represents an advanced industrial joining technique suitable for high-volume production. This process involves heating entire assemblies to the braze alloy's melting point, enabling simultaneous production of thousands of joints. 

The Liquid Cooling Cold Plates we made by Furnace Brazing. 

Our Liquid Cooling Cold Plates are perfect for high power electronics, inverters, DC-DC converters, wind inverters, solar inverters, automotive, EV/HEV, thermal electric (TEC), MRI amplifiers, power supplies, variable speed drives, locomotive, traction drives, medical device, lasers, RF amplifiers, IGBT Module, Optical Transceiver Module, Data Center, CPU, GPU, and Chillers.

Jacarlos Industries Co., Ltd founded in 1996, we have 30 years successful experience in thermal management solutions. We have experienced significant growth in the past years and continues to move upward to address the needs of the global market through improved technology.

We achieve to provide one-stop thermal managment solutions help our custmers succeed. From design, thermal simulation to manufacturing, customized projects are welcome. To know more about us 

www.jacarlosworld.com

https://www.youtube.com/@jacarlosworld

https://www.youtube.com/@ThermalManagement

Thermal Management for Optical Transceiver Module

 In a world of optical access networks, where data speeds soar and connectivity reigns supreme, the thermal management of optical transceivers is a crucial factor that is sometimes under-discussed. As the demand for higher speeds grows, the heat generated by optical devices poses increasing challenges. Without proper thermal management, this excessive heat can lead to performance degradation, reduced reliability, and lifespan, increasing optical equipment's capital and operating expenditures. 

Optical transceivers play a crucial role in modern telecommunications and data networking systems, facilitating the transmission of data over optical fibers. One often-overlooked factor that significantly influences the performance and reliability of these transceivers is their operating temperature. In this blog post, we will delve into everything you need to know about optical transceiver operating temperatures, exploring the impact on performance, common temperature specifications, and the importance of temperature management.

The best way to manage heat is to produce less of it in the first place. Optical transceivers consist of various optical and electronic components, including lasers, photodiodes, modulators, electrical drivers and converters, and even digital signal processors. Each of these elements generates heat as a byproduct of their operation. However, photonic and electronic technology advances have enabled greater device integration, resulting in smaller form factors and reduced power consumption.

                               

     Thermal Management for Optical Transceiver Module

https://drive.google.com/file/d/1TepKtjfMCjNKL41p5y_AgXF3aHUiYy57/view?usp=drive_link

Jacarlos Industries Co., Ltd founded in 1996, we have 30 years successful experience in thermal management solutions . We have experienced significant growth in the past years and continues to move upward to address the needs of the global market through improved technology. 

We achieve to provide one-stop thermal managment solutions help our custmers succeed. From design, thermal simulation to manufacturing, customized projects are welcome. 

 To know more about us 

www.jacarlosworld.com

https://www.youtube.com/@jacarlosworld

https://www.youtube.com/@ThermalManagement

How to make a GPU liquid cold plate?

 1.Make a micro-channel Copper fins skiving heat sink.

2.Seal micro-channel Copper fins heat sink by a cover with furnace brazing.

3.Test the leackage and other specification.

4.Connect the pipe & quick couplings.

We have mature Liquid Cooling Solutions and products for Nvidia 4090 / H100 / H800 / B200 / GB200 GPUs, if any RFQ, welcome to contact us info@jacarlosworld.com

Our Liquid Cooling Cold Plates are perfect for: high power electronics, inverters, DC-DC converters, wind inverters, solar inverters, automotive, hybrid and electric vehicles, IGBT modules, thermal electric (TEC), MRI amplifiers, power supplies, variable speed drives, locomotive, traction drives, medical device, lasers, RF amplifiers, data center, CPU, GPU, and chillers www.jacarlosworld.com

Bonded fins heat sinks

Hereby we'd like to introduce our bonded fins heat sinks. 

1.Bonded fin heat sinks are an assembly of a grooved base with individual fins bonded into the grooves. The fins are inserted into the base grooves and are joined by epoxying, brazing, or soldering.

2.Bonded & Brazed Fin Heat Sink Product Details:

(1).Materials:

Aluminum

Copper

Stainless Steel

Inconel

(2).General Design Guidelines:

Fin thickness typically ranges from .010” to .080” (other thicknesses as needed)

Brazed, soldered or thermal epoxy bonded depending on thermal resistance required

Fins can easily be non-uniform geometry, especially length, with no post machining

3.We provide one-stop thermal-management solutions, from R & D, thermal simulation to manufacturing, products include Bonded Fin Heat Sink, Skived Heat Sink, Pin Fin Heat Sink, Extrusion heat sink, Heat Pipe Heat Sink, Water cooled heat sink, Liquid Cold Plate www.jacarlosworld.com 

Inner Grooved Copper Tube (IGT) Cold Plate improve 30% cooling performance

Due to the increase in internal surface area of inner grooved copper tubes, the thermal conductivity is improved by 20 to 30% compared to bare tubes.

There are several main specifications for tube diameters, including 12.7mm, 9.52mm, 7.94mm, 7mm, 6.35mm, and 5mm, among which 9.52mm and 7mm are the most commonly used.

The IGT Cold plates are widely used in:

* Electric power transmission

High voltage direct current transmission(HVDC)、HVDC Flexible、IGBT、SVG、etc.  

* New Energy

Power Converters、Wind power generation、Wind Turbines、Solar Inverters, etc.

*Transportation

Rail Traction System、Hybrid /Electric Vehicle (HEV/EV), Auxillary Vehicle Systems

* Others

 Industrial frequency conversion、Industrial Motor Controls、Medical Device、Laser Equipments.

Jacarlos with 26 years' successful thermal managemnt solutions experience, from R&D, manufacturing to sales. Customzied proejcts are welcome.

  

www.jacarlosworld.com 

 https://www.youtube.com/@Jacarlosworld

Aluminum Skived Heat Sink Manufacturing Process

Aluminum Skived Heat Sink Manufacturing Process

Aluminum Skived Fins Heat Sink

We provide one-stop thermal-management solutions, from R & D, thermal simulation to manufacturing, products include Bonded Fin Heat Sink, Skived Heat Sink, Pin Fin Heat Sink, Extrusion heat sink, Heat Pipe Heat Sink, Water cooled heat sink, Liquid Cold Plate www.jacarlosworld.com