Liquid Cold Plate Manufacturing Process (FSW)

Liquid Cold Plate Manufacturing Process (FSW)

Liquid Cold Plate made by FSW

Liquid Cold plates Application

* Electric power transmission

High voltage direct current transmission(HVDC)、HVDC Flexible、IGBT、SVG、etc.  

* New Energy

Power Converters、Wind power generation、Wind Turbines、Solar Inverters, etc.

*Transportation

Rail Traction System、Hybrid /Electric Vehicle (HEV/EV), Auxillary Vehicle Systems

* Others

 Industrial frequency conversion、Industrial Motor Controls、Medical Equipments、Laser Equipments.

Friction Stir Welding Technology advantages

(1).More stronger and reliable leak proof seal, leak-free.

(2).Compatible with water or water/glycol, gasoline, oil, refrigerant and other fluids.

(3).Dual-sided cooling

(4).Provide superior thermal conductivity and more uniform surface temperature.

(5).High Efficiency for High Power

(6).Large-size available, now we can make 850mm*270mm*210mm (Al6061).           

(7).Low Volume, save space.

(8).Light weight configurations

(9).Material : Al6063 / Al6061 or  Al1050 / Al1070

Liquid Cold plates made by Friction Stir Welding （FSW）

https://youtu.be/rwvn_9xxSc4

Download technical documents about the Liquid Cold plates

https://drive.google.com/file/d/1qiTBph5x9SojoV6-eiIbKq_-pu_8enNM/view?usp=sharing

We provide one-stop thermal-management solutions, from R & D, thermal simulation to manufacturing, products include Bonded Fin Heat Sink, Skived Heat Sink, Pin Fin Heat Sink, Extrusion heat sink, Heat Pipe Heat Sink, Water cooled heat sink, Liquid Cold Plate www.jacarlosworld.com 

Vapor Chamber

A vapor chamber is essentially a flat heat pipe that can spread heat evenly in two dimensions. It consists of a hollow copper shell that has an internal wick structure to transport the fluid to the heat source and a vapor area for the transport of the vapor away from the heat source. The entire chamber is operated under vacuum so that the operation fluid (water) vaporizes at room temperature. This is how the vapor chamber very efficiently transports heat evenly across the surface of the condenser, allowing all the fins to work as hard as the ones that are over the center of the heat source. The vapor chamber performance will increase over that of a metallic heat sink the larger the base area and the smaller in the heat input. 

Vapor chambers offer superior thermal spreading performance over traditional solid metal heat spreaders by taking advantage of two-phase liquid/vapor transport.   Their lower weight and height over traditional solutions couples with their high thermal conductivity to give extremely low thermal resistance in-plane as well as through the thickness of the vapor chamber. Vapor Chambers are best suited for components with high heat densities (larger TDP in small chip sizes) which need to spread their heat to a larger area heat exchanger to achieve safe operating temperatures, thereby providing extended life and reliability for components and applied products

Vapor Chambers are designed to provide critical thermal solutions in the most limited spaces. One of the advantages of vapor chambers is that they can be used as heat flux transformer, cooling a high heat flux from an electronic chip or laser diode, and transforming it to a lower heat flux that can be removed by natural or forced convection.

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Heat Pipe Heat Sink

We can handle heat pipe heat sink project from conception to production, deliver a customized heat pipe heat sink solution for companies in industries such as aerospace, electronics and many others. As a premier thermal management solutions provider with a strong focus on research and development, we can provide customized heat pipe heat sinks for your specific applications.


1.Design and Modeling of Heat Pipe Assemblies

Thermal Analysis of Heat Pipe Heat Sink

Three-dimensional simulation is extremely valuable in the design of Heat Pipe Heat Sink. Because of the complex thermodynamic process (evaporation and condensation) within a heat pipe, direct simulation of physical process is difficult and time-consuming. For most engineering designs, a simple workaround is to model the heat pipe as a super conductor with a high effective thermal conductivity. The longer the heat pipe is, the higher the effective thermal conductivity should be. The assumed effective thermal conductivity shall be corrected after prototypes are made and thermal measurements are performed.


2.Assembly of Heat Pipes and Fins

Fins can be assembled onto heat pipes in two methods. One is to solder fins to heat pipes, the other is to use interference fit (also called press fit or friction fit), in which the fins have holes that are slightly smaller than the diameter of the heat pipe. By pressing the fins onto the heat pipes with pressure, the heat pipe and the fins are tightly assembled. When temperature arises in working conditions, thermal expansion of the fins and heat pipes will make the assembly even more secure.


3.Heat Pipe Heat Sinks

Heat pipes offer extremely high thermal conductivity in their longitudinal directions. Depending on the lengths and manufacturing factors, the effective thermal conductivity of heat pipes can be 10 to 1000 times of the thermal conductivity of pure copper. When coupled with highly conductive fins or spreaders, heat pipes become a powerful tool that can quickly dissipate large quantities of heat to the environment or a location where additional cooling systems can be installed.

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How a Heat Pipe Works?

A heat pipe is a closed evaporator-condenser system consisting of a sealed, hollow tube whose inside walls are lined with a capillary structure or wick. Thermodynamic working fluid, with substantial vapor pressure at the desired operating temperature, saturates the pores of the wick in a state of equilibrium between liquid and vapor. When heat is applied to the heat pipe, the liquid in the wick heats and evaporates. As the evaporating fluid fills the heat pipe hollow center, it diffuses throughout its length. Condensation of the vapor occurs wherever the temperature is even slightly below that of the evaporation area. As it condenses, the vapor gives up the heat it acquired during evaporation. This effective high thermal conductance helps maintain near constant temperatures along the entire length of the pipe.

1.Heat Pipe Operation Principle

2.Heat Pipe Features & Benefits

Tube material: copper

Wick structures: grooved or sintered copper powder

High thermal conductivity

Light weight

Fast thermal response

3.Applications for Heat Pipes

Compact Electronics Enclosures

Aerospace

Medical

Consumer Electronics

HVAC

They are used to transfer heat with minimal temperature difference from the heat source (evaporator) to the heat sink (condenser) as well as to spread the heat across a surface. Many factors have to be considered in choosing a heat pipe for a specific application. The effective length (Leff) is a useful indicator of the length of a heat pipe as employed in a specific application (accounting for evaporation and condensation lengths). Heat pipes come in round or flat shapes. Flat heat pipes are easier to attach to heat dissipating components while the round heat pipes offer advantages for certain fin configurations at the condenser end.

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50W LED Pin fin heat sink

1.Content

 Compare the latest pin-fin HS with original extruded HS: cooling performance and total weight.
● Original extruded HS=736.8g
● Latest pin-in HS=583g (higher cooling performance)
 Below is the detailed HS information (material=Al6063-T5)

Note: HS is the abbreviation of heat sink

2.Result Comparison

 The max temperature of HS : Original extruded HS=64.8℃, Pin-fin HS= 63.3℃

3.Conclusion

Summary result for the 2 heat sinks

● Original extruded HS=64.8℃,weight=736.8g, total height=89mm
● Latest Pin-fin HS= 63.3℃,weight=583g, total height=109mm

 The latest pin-fin HS provides -1.5K benefit, and reduces 20% weight

 If Al1050 be applied for pin fin HS, the pin-fin HS provides -2.5K benefit

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How to select a heat sink?

With the increase in heat dissipation from microelectronic devices and the reduction in overall form factors, thermal management becomes a more and more important element of electronic product design.

Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment.

The relationship between the reliability and the operating temperature of a typical silicon semiconductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device.

Therefore, long life and reliable performance of a component may be achieved by effectively controlling the device operating temperature within the limits set by the device design engineers.

Heat sinks are devices that enhance heat dissipation from a hot surface, usually the case of a heat generating component, to a cooler ambient, usually air.

For the following discussions, air is assumed to be the cooling fluid. In most situations, heat transfer across the interface between the solid surface and the coolant air is the least efficient within the system, and the solid-air interface represents the greatest barrier for heat dissipation.

A heat sink lowers this barrier mainly by increasing the surface area that is in direct contact with the coolant.

This allows more heat to be dissipated and/or lowers the device operating temperature.

The primary purpose of a heat sink is to maintain the device temperature below the maximum allowable temperature specified by the device manufacturer.

                               

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Types of Heat Sinks

There are numerous heat sink choices from zipper pack fins to extruded fin stacks, each with their own cost and performance characteristics.  While the heat sink choice can markedly affect heat dissipation performance, the biggest performance boost for any type of heat exchanger comes with forced convection.

1.Extrusion Heat Sink

2.Die Casting Heat Sink

3.Skived Heat Sink

4.Bonded fins heat sink

5.Pin Fin Heat Sink

6.Heat Pipe Heat Sink

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