Bonded fins heat sinks

Hereby we'd like to introduce our bonded fins heat sinks. 

1.Bonded fin heat sinks are an assembly of a grooved base with individual fins bonded into the grooves. The fins are inserted into the base grooves and are joined by epoxying, brazing, or soldering.

2.Bonded & Brazed Fin Heat Sink Product Details:

(1).Materials:

Aluminum

Copper

Stainless Steel

Inconel

(2).General Design Guidelines:

Fin thickness typically ranges from .010” to .080” (other thicknesses as needed)

Brazed, soldered or thermal epoxy bonded depending on thermal resistance required

Fins can easily be non-uniform geometry, especially length, with no post machining

3.We provide one-stop thermal-management solutions, from R & D, thermal simulation to manufacturing, products include Bonded Fin Heat Sink, Skived Heat Sink, Pin Fin Heat Sink, Extrusion heat sink, Heat Pipe Heat Sink, Water cooled heat sink, Liquid Cold Plate www.jacarlosworld.com 

Aluminum Skived Heat Sink Manufacturing Process

Aluminum Skived Heat Sink Manufacturing Process

Aluminum Skived Fins Heat Sink

We provide one-stop thermal-management solutions, from R & D, thermal simulation to manufacturing, products include Bonded Fin Heat Sink, Skived Heat Sink, Pin Fin Heat Sink, Extrusion heat sink, Heat Pipe Heat Sink, Water cooled heat sink, Liquid Cold Plate www.jacarlosworld.com 

Skived Heat Sink Manufacturing Process

The skived fins heat sink has some features and benefits as following.

(1).Thin fins and high fin density

(2).Maximum heat dissipation under forced convection (with high airflow)

(3).No interface joint (or thermal resistance) between the fins and base

(4).High aspect ratio (up to 50)

(5).Easy and inexpensive to prototype

(6).Low  tooling costs

(7).Short lead time

(8).Can have embedded heat pipes to further boost performance

(9).Anti-oxidation surface treatment helps extend serving time

Skiving - Copper

Skiving - Aluminum

https://youtu.be/beGnGXEU634

We provide one-stop thermal-management solutions, from R & D, thermal simulation to manufacturing, products include Bonded Fin Heat Sink, Skived Heat Sink, Pin Fin Heat Sink, Extrusion heat sink, Heat Pipe Heat Sink, Water cooled heat sink, Liquid Cold Plate www.jacarlosworld.com 

Vapor Chamber

A vapor chamber is essentially a flat heat pipe that can spread heat evenly in two dimensions. It consists of a hollow copper shell that has an internal wick structure to transport the fluid to the heat source and a vapor area for the transport of the vapor away from the heat source. The entire chamber is operated under vacuum so that the operation fluid (water) vaporizes at room temperature. This is how the vapor chamber very efficiently transports heat evenly across the surface of the condenser, allowing all the fins to work as hard as the ones that are over the center of the heat source. The vapor chamber performance will increase over that of a metallic heat sink the larger the base area and the smaller in the heat input. 

Vapor chambers offer superior thermal spreading performance over traditional solid metal heat spreaders by taking advantage of two-phase liquid/vapor transport.   Their lower weight and height over traditional solutions couples with their high thermal conductivity to give extremely low thermal resistance in-plane as well as through the thickness of the vapor chamber. Vapor Chambers are best suited for components with high heat densities (larger TDP in small chip sizes) which need to spread their heat to a larger area heat exchanger to achieve safe operating temperatures, thereby providing extended life and reliability for components and applied products

Vapor Chambers are designed to provide critical thermal solutions in the most limited spaces. One of the advantages of vapor chambers is that they can be used as heat flux transformer, cooling a high heat flux from an electronic chip or laser diode, and transforming it to a lower heat flux that can be removed by natural or forced convection.

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Heat Pipe Heat Sink

We can handle heat pipe heat sink project from conception to production, deliver a customized heat pipe heat sink solution for companies in industries such as aerospace, electronics and many others. As a premier thermal management solutions provider with a strong focus on research and development, we can provide customized heat pipe heat sinks for your specific applications.


1.Design and Modeling of Heat Pipe Assemblies

Thermal Analysis of Heat Pipe Heat Sink

Three-dimensional simulation is extremely valuable in the design of Heat Pipe Heat Sink. Because of the complex thermodynamic process (evaporation and condensation) within a heat pipe, direct simulation of physical process is difficult and time-consuming. For most engineering designs, a simple workaround is to model the heat pipe as a super conductor with a high effective thermal conductivity. The longer the heat pipe is, the higher the effective thermal conductivity should be. The assumed effective thermal conductivity shall be corrected after prototypes are made and thermal measurements are performed.


2.Assembly of Heat Pipes and Fins

Fins can be assembled onto heat pipes in two methods. One is to solder fins to heat pipes, the other is to use interference fit (also called press fit or friction fit), in which the fins have holes that are slightly smaller than the diameter of the heat pipe. By pressing the fins onto the heat pipes with pressure, the heat pipe and the fins are tightly assembled. When temperature arises in working conditions, thermal expansion of the fins and heat pipes will make the assembly even more secure.


3.Heat Pipe Heat Sinks

Heat pipes offer extremely high thermal conductivity in their longitudinal directions. Depending on the lengths and manufacturing factors, the effective thermal conductivity of heat pipes can be 10 to 1000 times of the thermal conductivity of pure copper. When coupled with highly conductive fins or spreaders, heat pipes become a powerful tool that can quickly dissipate large quantities of heat to the environment or a location where additional cooling systems can be installed.

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How a Heat Pipe Works?

A heat pipe is a closed evaporator-condenser system consisting of a sealed, hollow tube whose inside walls are lined with a capillary structure or wick. Thermodynamic working fluid, with substantial vapor pressure at the desired operating temperature, saturates the pores of the wick in a state of equilibrium between liquid and vapor. When heat is applied to the heat pipe, the liquid in the wick heats and evaporates. As the evaporating fluid fills the heat pipe hollow center, it diffuses throughout its length. Condensation of the vapor occurs wherever the temperature is even slightly below that of the evaporation area. As it condenses, the vapor gives up the heat it acquired during evaporation. This effective high thermal conductance helps maintain near constant temperatures along the entire length of the pipe.

1.Heat Pipe Operation Principle

2.Heat Pipe Features & Benefits

Tube material: copper

Wick structures: grooved or sintered copper powder

High thermal conductivity

Light weight

Fast thermal response

3.Applications for Heat Pipes

Compact Electronics Enclosures

Aerospace

Medical

Consumer Electronics

HVAC

They are used to transfer heat with minimal temperature difference from the heat source (evaporator) to the heat sink (condenser) as well as to spread the heat across a surface. Many factors have to be considered in choosing a heat pipe for a specific application. The effective length (Leff) is a useful indicator of the length of a heat pipe as employed in a specific application (accounting for evaporation and condensation lengths). Heat pipes come in round or flat shapes. Flat heat pipes are easier to attach to heat dissipating components while the round heat pipes offer advantages for certain fin configurations at the condenser end.

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Skiving Fins Heat Sink

Skived fin heat sinks offer highly optimized cooling as they allow for higher fin densities but do not have an interface joint where heat transfer could be impeded. Unlike bonded or brazed Heat Sinks, Skived Heat Sinks are constructed from a single piece of material and therefore have no thermal resistance between the base and the fins. They are manufactured by precisely slicing the top of the base and folding it back and repeating at regular intervals to create the fins.

The skiving process enables high fin density and thin fin heat sink geometries which provide optimal thermal performance. By packing as much fin surface area into a given volume, skived fin heat sinks have greater heat transfer than other single piece construction heat sinks such as extruded aluminum heat sinks. Compared to extruded aluminum, skived fin heat sink fabrication does not rely on expensive tooling which provides greater design flexibility. Instead, each fin is cut separately using the same tool which allows for lower tooling costs.

Additionally skived heat sinks can be constructed of aluminum or copper allowing for full, one-piece copper solutions for high performance cooling.

1.(1). Copper Skived Heat Sink

(2). Copper Skived Heat Sink Manufacturing Process

2.(1). Aluminum Skived Heat Sink

(2). Aluminum Skived Heat Sink Manufacturing Process

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50W LED Pin fin heat sink

1.Content

 Compare the latest pin-fin HS with original extruded HS: cooling performance and total weight.
● Original extruded HS=736.8g
● Latest pin-in HS=583g (higher cooling performance)
 Below is the detailed HS information (material=Al6063-T5)

Note: HS is the abbreviation of heat sink

2.Result Comparison

 The max temperature of HS : Original extruded HS=64.8℃, Pin-fin HS= 63.3℃

3.Conclusion

Summary result for the 2 heat sinks

● Original extruded HS=64.8℃,weight=736.8g, total height=89mm
● Latest Pin-fin HS= 63.3℃,weight=583g, total height=109mm

 The latest pin-fin HS provides -1.5K benefit, and reduces 20% weight

 If Al1050 be applied for pin fin HS, the pin-fin HS provides -2.5K benefit

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How to select a heat sink?

With the increase in heat dissipation from microelectronic devices and the reduction in overall form factors, thermal management becomes a more and more important element of electronic product design.

Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment.

The relationship between the reliability and the operating temperature of a typical silicon semiconductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device.

Therefore, long life and reliable performance of a component may be achieved by effectively controlling the device operating temperature within the limits set by the device design engineers.

Heat sinks are devices that enhance heat dissipation from a hot surface, usually the case of a heat generating component, to a cooler ambient, usually air.

For the following discussions, air is assumed to be the cooling fluid. In most situations, heat transfer across the interface between the solid surface and the coolant air is the least efficient within the system, and the solid-air interface represents the greatest barrier for heat dissipation.

A heat sink lowers this barrier mainly by increasing the surface area that is in direct contact with the coolant.

This allows more heat to be dissipated and/or lowers the device operating temperature.

The primary purpose of a heat sink is to maintain the device temperature below the maximum allowable temperature specified by the device manufacturer.

                               

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Types of Heat Sinks

There are numerous heat sink choices from zipper pack fins to extruded fin stacks, each with their own cost and performance characteristics.  While the heat sink choice can markedly affect heat dissipation performance, the biggest performance boost for any type of heat exchanger comes with forced convection.

1.Extrusion Heat Sink

2.Die Casting Heat Sink

3.Skived Heat Sink

4.Bonded fins heat sink

5.Pin Fin Heat Sink

6.Heat Pipe Heat Sink

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Pin fin heat sink by Forging

The Pin Fin heat sink made by a new manufacturing process “cold forging”. 

The new process makes it possible to achieve significantly cooling performance against other manufacturing process, with some obvious advantages as following.

*Complete in one piece by cold forging with no interface

*Material: Al1050/1070 or Al6063, C1100, Cu/Al bonded Material

*High material density increases thermal conductivity

*Round pins improves airflow smooth through

*High aspect ratio 1:50

*Better cooling performance, 

*Wide range of geometry

*Weight reduction. 

*High quality and very competitive price

1.Aluminum Pin Fin Heat Sink

   Material  : Al1050/Al1070/Al6063

2. (1).Copper Pin Fin Heat Sink

    Material : C1100

(2).Copper Pin Fin Baseplate

   Material: C1100 

3.Cu/Al Bonded Pin Fin Heat Sink 

    Material : C1100 & Al1050 Bonded.

4.Comparison with different materials

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Copper Pin Fin heat sink for IGBT Module

Hereby we'd like to recommend the Copper Pin Fin heat sink for IGBT Module.

The Pin Fin heat sink made by a new manufacturing process “ forging”. The process makes it possible to achieve significantly cooling performance against other manufacturing process, with some obvious advantages as following.

*Complete in one piece by cold forging with no interface

*Material: Al1050/1070 or Al6063, C1100, Cu/Al bonded Material

*High material density increases thermal conductivity

*Round pins improves airflow smooth through (Round, Ellipse,Square fins are available)

*High aspect ratio 1:50

*Better cooling performance, 

*Wide range of geometry

*Weight reduction. 

*High quality and very competitive price

Round, Ellipse,Square fins are available

Pls check the following link to download the related tech spec.

                                                          Copper Pin Fin heat sink for IGBT Module.

Learn more about the "forging" process, pls check

Pin fin heat sink made by forging

If any interest, welcome to contact us at any time info@jacarlosworld.com

More about the pin fin heat sink www.jacarlosworld.com