Copper Pin Fin heat sink for IGBT Module

Hereby we'd like to recommend the Copper Pin Fin heat sink for IGBT Module.

The Pin Fin heat sink made by a new manufacturing process “ forging”. The process makes it possible to achieve significantly cooling performance against other manufacturing process, with some obvious advantages as following.

*Complete in one piece by cold forging with no interface

*Material: Al1050/1070 or Al6063, C1100, Cu/Al bonded Material

*High material density increases thermal conductivity

*Round pins improves airflow smooth through (Round, Ellipse,Square fins are available)

*High aspect ratio 1:50

*Better cooling performance, 

*Wide range of geometry

*Weight reduction. 

*High quality and very competitive price

Round, Ellipse,Square fins are available

Pls check the following link to download the related tech spec.

                                                          Copper Pin Fin heat sink for IGBT Module.

Learn more about the "forging" process, pls check

Pin fin heat sink made by forging

If any interest, welcome to contact us at any time info@jacarlosworld.com

More about the pin fin heat sink www.jacarlosworld.com