Skiving Fins Heat Sink

Skived fin heat sinks offer highly optimized cooling as they allow for higher fin densities but do not have an interface joint where heat transfer could be impeded. Unlike bonded or brazed Heat Sinks, Skived Heat Sinks are constructed from a single piece of material and therefore have no thermal resistance between the base and the fins. They are manufactured by precisely slicing the top of the base and folding it back and repeating at regular intervals to create the fins.

The skiving process enables high fin density and thin fin heat sink geometries which provide optimal thermal performance. By packing as much fin surface area into a given volume, skived fin heat sinks have greater heat transfer than other single piece construction heat sinks such as extruded aluminum heat sinks. Compared to extruded aluminum, skived fin heat sink fabrication does not rely on expensive tooling which provides greater design flexibility. Instead, each fin is cut separately using the same tool which allows for lower tooling costs.

Additionally skived heat sinks can be constructed of aluminum or copper allowing for full, one-piece copper solutions for high performance cooling.

1.(1). Copper Skived Heat Sink

(2). Copper Skived Heat Sink Manufacturing Process

2.(1). Aluminum Skived Heat Sink

(2). Aluminum Skived Heat Sink Manufacturing Process

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50W LED Pin fin heat sink

1.Content

 Compare the latest pin-fin HS with original extruded HS: cooling performance and total weight.
● Original extruded HS=736.8g
● Latest pin-in HS=583g (higher cooling performance)
 Below is the detailed HS information (material=Al6063-T5)

Note: HS is the abbreviation of heat sink

2.Result Comparison

 The max temperature of HS : Original extruded HS=64.8℃, Pin-fin HS= 63.3℃

3.Conclusion

Summary result for the 2 heat sinks

● Original extruded HS=64.8℃,weight=736.8g, total height=89mm
● Latest Pin-fin HS= 63.3℃,weight=583g, total height=109mm

 The latest pin-fin HS provides -1.5K benefit, and reduces 20% weight

 If Al1050 be applied for pin fin HS, the pin-fin HS provides -2.5K benefit

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How to select a heat sink?

With the increase in heat dissipation from microelectronic devices and the reduction in overall form factors, thermal management becomes a more and more important element of electronic product design.

Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment.

The relationship between the reliability and the operating temperature of a typical silicon semiconductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device.

Therefore, long life and reliable performance of a component may be achieved by effectively controlling the device operating temperature within the limits set by the device design engineers.

Heat sinks are devices that enhance heat dissipation from a hot surface, usually the case of a heat generating component, to a cooler ambient, usually air.

For the following discussions, air is assumed to be the cooling fluid. In most situations, heat transfer across the interface between the solid surface and the coolant air is the least efficient within the system, and the solid-air interface represents the greatest barrier for heat dissipation.

A heat sink lowers this barrier mainly by increasing the surface area that is in direct contact with the coolant.

This allows more heat to be dissipated and/or lowers the device operating temperature.

The primary purpose of a heat sink is to maintain the device temperature below the maximum allowable temperature specified by the device manufacturer.

                               

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Types of Heat Sinks

There are numerous heat sink choices from zipper pack fins to extruded fin stacks, each with their own cost and performance characteristics.  While the heat sink choice can markedly affect heat dissipation performance, the biggest performance boost for any type of heat exchanger comes with forced convection.

1.Extrusion Heat Sink

2.Die Casting Heat Sink

3.Skived Heat Sink

4.Bonded fins heat sink

5.Pin Fin Heat Sink

6.Heat Pipe Heat Sink

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The large size liquid cold plate we manufactured

1.The large size liquid cold plate we manufactured 

(1). Tube cold plate

(2). Liquid cold plate by FSW (friction stir welding)

                                   

Liquid cold plate manufacturing process (FSW)

2.Our business: thermal management, Electronics cooling, Thermal-cooling Projects, Turnkey Thermal management solutions, liquid cold plate for IGBT, EV/HEV, Medical device
3.We provide one-stop thermal-management solutions, from R & D, thermal simulation to manufacturing, products include Skived Heat Sink, Pin Fin Heat Sink, Heat Pipe Heat Sink, Liquid Cold Plate.

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Pin fin heat sink by Forging

The Pin Fin heat sink made by a new manufacturing process “cold forging”. 

The new process makes it possible to achieve significantly cooling performance against other manufacturing process, with some obvious advantages as following.

*Complete in one piece by cold forging with no interface

*Material: Al1050/1070 or Al6063, C1100, Cu/Al bonded Material

*High material density increases thermal conductivity

*Round pins improves airflow smooth through

*High aspect ratio 1:50

*Better cooling performance, 

*Wide range of geometry

*Weight reduction. 

*High quality and very competitive price

1.Aluminum Pin Fin Heat Sink

   Material  : Al1050/Al1070/Al6063

2. (1).Copper Pin Fin Heat Sink

    Material : C1100

(2).Copper Pin Fin Baseplate

   Material: C1100 

3.Cu/Al Bonded Pin Fin Heat Sink 

    Material : C1100 & Al1050 Bonded.

4.Comparison with different materials

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Copper Pin Fin heat sink for IGBT Module

Hereby we'd like to recommend the Copper Pin Fin heat sink for IGBT Module.

The Pin Fin heat sink made by a new manufacturing process “ forging”. The process makes it possible to achieve significantly cooling performance against other manufacturing process, with some obvious advantages as following.

*Complete in one piece by cold forging with no interface

*Material: Al1050/1070 or Al6063, C1100, Cu/Al bonded Material

*High material density increases thermal conductivity

*Round pins improves airflow smooth through (Round, Ellipse,Square fins are available)

*High aspect ratio 1:50

*Better cooling performance, 

*Wide range of geometry

*Weight reduction. 

*High quality and very competitive price

Round, Ellipse,Square fins are available

Pls check the following link to download the related tech spec.

                                                          Copper Pin Fin heat sink for IGBT Module.

Learn more about the "forging" process, pls check

Pin fin heat sink made by forging

If any interest, welcome to contact us at any time info@jacarlosworld.com

More about the pin fin heat sink www.jacarlosworld.com